Chips
3 articles.
SK Hynix's $4B Indiana Bet: Why HBM Bottleneck Stays Overseas
SK Hynix Indiana facility: HBM packaging in U.S., but fab stays overseas. Why the AI memory bottleneck persists through 2028.
Read story →Lam Research's $3B Expansion: Why AI Chip Speed Now Beats Capacity
Lam Research's $3B R&D expansion marks a shift: AI chip bottleneck is innovation speed, not capacity. Equipment makers now control the supply chain.
Read story →TSMC Accelerates 1.4nm Mass Production to 2028, Widening Foundry Lead Over Samsung
TSMC accelerates 1.4nm mass production to 2028 while Samsung delays to 2029, widening the foundry lead and reshaping AI chip supply chains.
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